屬性

產學成果

技術或專利歸屬權

黃練德

技術或專利說明摘要

本新型專利係提供一種矽晶片新型蝕刻液塗佈機構,以陣列點放及多噴頭進行漿料塗佈,可定點定時定量吐出蝕刻漿料呈半固態狀膠水樣,其大面積塗佈(六英寸方)將以單一點放面積大小配合間距之控制,蝕刻液藉由擴散作用可達到均勻覆蓋於整面矽晶片或某個定點;膠體蝕刻塗佈機構,包含一精密移載機構及一點膠噴頭機構。

The new patented of an equipment of spraying silicon chip. Use array point put and multi-nozzle method to spraying sizing material. The sizing material is semi-solid like glue, can positioning and timing and quantitative to outflow. The large area(6″) spraying, by single area size to collocation control spacing. The sizing material by diffusing can uniform coverage entire surface or some point. The Colloidal Etching Spraying mechanism include a precision transfer mechanism and a spraying nozzle mechanism.

產業別

太陽能電池矽晶片

技術或專利應用範圍

太陽能電池矽晶片塗佈、不織布噴塗

聯絡人資訊

梁家雯(03-4850369/demi@infina.com.tw)

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